Polishing apparatus and method of bonding and removing expendable replacement components thereof

ABSTRACT

A polishing apparatus includes a top ring for holding a substrate and a polishing table having a polishing surface. The substrate held by the top ring is brought into contact with the polishing surface, and in this state, the polishing table and the substrate are moved relative to each other to thereby polish the substrate. Expendable replacement components to be bonded to the top ring and the polishing table, such as a backing film, a pressure ring and a polishing cloth, are bonded in such a manner that pieces of heat-sensitive adhesive tape are interposed between the expendable replacement components on the one hand and the top ring and the polishing table on the other. The heat-sensitive adhesive tape is switchable between a non-adhesive state and a adhesive state according to whether the temperature thereof is higher or lower than a predetermined set temperature. Thus, the expendable replacement components can be bonded and removed extremely easily by the temperature control of the heat-sensitive adhesive tape.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a polishing apparatus having atop ring for holding a substrate and a polishing table having apolishing surface, wherein the substrate held by the top ring is broughtinto contact with the polishing surface, and in this state, thepolishing table and the substrate are moved relative to each other tothereby polish the substrate. The present invention also relates to amethod of bonding and removing expendable replacement components of thepolishing apparatus.

[0002] Conventionally, a polishing apparatus for polishing substrates,e.g. semiconductor substrates, has a turntable with a polishing clothbonded to the top surface thereof. A substrate held by a top ring or thelike is brought into contact with the upper surface of the polishingcloth on the turntable. In this state, the turntable is rotated, and thetop ring is also rotated, thereby polishing a surface to be polished ofthe substrate by a relative motion between the polishing cloth and thesubstrate.

[0003] To bond the polishing cloth to the top surface of the turntablein the polishing apparatus arranged as stated above, as shown in FIG. 1,an adhesive 12 is applied to either or both of the back of the polishingcloth 11 and the top surface of the turntable 10 (in the illustratedexample, the adhesive 12 is applied to the back of the polishing cloth11). As the adhesive 12, an adhesive exhibiting high peel strength hasheretofore been used to prevent the polishing cloth 11 from undesirablyseparating from the turntable 10 during the substrate polishing process.

[0004] For this reason, much human power and a special jig are requiredto remove the polishing cloth 11 from the turntable 10 at the time ofreplacement of the polishing cloth 11. Further, because much human poweris needed to remove it, the polishing cloth 11 is damaged to aconsiderable extent when removed from the turntable 10. Therefore, ifthe polishing cloth 11 is removed before the time for replacement, itcannot be reused.

[0005] Although an adhesive that is unlikely to remain on the topsurface of the turntable 10 after the polishing cloth 11 has beenremoved therefrom is used as the adhesive 12, a certain amount ofadhesive is unavoidably left on the top surface of the turntable 10.Therefore, it has been invariably necessary to remove the remainingadhesive by wiping the top surface of the turntable 10 with alcoholevery time the polishing cloth 11 is removed. The above-describedoperation of removing the polishing cloth 11 and the operation of wipingthe top surface of the turntable 10 with alcohol to remove the remainingadhesive are time-consuming and difficult.

[0006] Similar problems are also experienced with the bonding andremoval of a backing film, which is bonded to the substrate holdingsurface of the top ring of the polishing apparatus, and a pressure ringbonded to the top ring and positioned at the outer peripheral portion ofthe substrate as held by the top ring.

SUMMARY OF THE INVENTION

[0007] The present invention was made in view of the above-describedcircumstances.

[0008] Accordingly, an object of the present invention is to provide apolishing apparatus wherein expendable replacement components such as apolishing cloth, a backing film and a pressure ring can be readilybonded to and removed from the polishing table and the top ring, andparticularly, the expendable replacement components bonded to thepolishing table and the top ring can be removed easily with minimalremoval force, and also provide a method of bonding and removing suchexpendable replacement components of the polishing apparatus.

[0009] According to a first aspect thereof, the present inventionprovides a polishing apparatus having a top ring for holding a substrateand a polishing table having a polishing surface, wherein the substrateheld by the top ring is brought into contact with the polishing surface,and in this state, the polishing table and the substrate are movedrelative to each other to thereby polish the substrate. In the polishingapparatus, expendable replacement components to be bonded to the topring and the polishing table are bonded to the top ring and thepolishing table in such a manner that pieces of heat-sensitive adhesive(agent) or adhesive tape are interposed between the expendablereplacement components on the one hand and the top ring and thepolishing table on the other. The heat-sensitive adhesive tape isswitchable between a non-adhesive state and a adhesive state accordingto whether the temperature thereof is higher or lower than apredetermined set temperature.

[0010] As stated above, pieces of heat-sensitive adhesive tape areinterposed between the expendable replacement components on the one handand the top ring and the polishing table on the other to bond theexpendable replacement components to the top ring and the polishingtable. Because the heat-sensitive adhesive tape has the nature ofswitching between a non-adhesive (non-tacky) state and a adhesive stateaccording to whether the temperature thereof is higher or lower than apredetermined set temperature, the expendable replacement components canbe bonded and removed easily by heating or cooling the heat-sensitiveadhesive tape above or below the set temperature. Particularly, when theheat-sensitive adhesive tape is made non-adhesive by heating or cooling,the expendable replacement components can be removed easily with minimalremoval force. Further, because the removal force is minimized, theexpendable replacement components can be removed without being damaged.

[0011] According to a second aspect of the present invention, theexpendable replacement components of the above-described polishingapparatus are at least one selected from the group consisting of apolishing cloth bonded to the top surface of the polishing table, abacking film bonded to the substrate holding surface of the top ring,and a pressure ring bonded to the top ring and positioned at the outerperipheral portion of the substrate as held by the top ring.

[0012] According to a third aspect thereof, the present inventionprovides an expendable replacement component bonding and removing methodfor use in a polishing apparatus. The polishing apparatus has a top ringfor holding a substrate and a polishing table having a polishingsurface. The substrate held by the top ring is brought into contact withthe polishing surface, and in this state, the polishing table and thesubstrate are moved relative to each other to thereby polish thesubstrate. According to the method of the present invention, expendablereplacement components to be bonded to the top ring and the polishingtable are placed over the top ring and the polishing table in such amanner that pieces of heat-sensitive adhesive tape are interposedbetween the expendable replacement components on the one hand and thetop ring and the polishing table on the other. The heat-sensitiveadhesive tape is switchable between a non-adhesive state and a adhesivestate according to whether the temperature thereof is higher or lowerthan a predetermined set temperature. Then, the heat-sensitive adhesivetape is heated above or cooled below the set temperature, therebybonding the expendable replacement components to the top ring and thepolishing table or removing the expendable replacement components bondedto the top ring and the polishing table.

[0013] As stated above, pieces of heat-sensitive adhesive tape areinterposed between the expendable replacement components on the one handand the top ring and/or the polishing table on the other, and theheat-sensitive adhesive tape is switched between a non-adhesive stateand a adhesive state by heating or cooling it above or below the settemperature. Therefore, it is easy to bond and remove the expendablereplacement components. Particularly, when the heat-sensitive adhesivetape is made non-adhesive, the expendable replacement components can beremoved easily with minimal removal force.

[0014] According to a fourth aspect of the present invention, theexpendable replacement components in the method according to the thirdaspect of the present invention are bonded to the top ring and thepolishing table or removed therefrom by using a jig for heating orcooling the pieces of heat-sensitive adhesive tape interposed betweenthe expendable replacement components on the one hand and the top ringand/or the polishing table on the other.

[0015] The heat-sensitive adhesive tape can be readily made non-adhesiveby using the jig for heating or cooling the heat-sensitive adhesive tapeas stated above.

[0016] According to a fifth aspect of the present invention, theexpendable replacement components in the method according to the thirdor fourth aspect of the present invention are at least one selected fromthe group consisting of a polishing cloth bonded to the top surface ofthe polishing table, a backing film bonded to the substrate holdingsurface of the top ring, and a pressure ring bonded to the top ring andpositioned at the outer peripheral portion of the substrate as held bythe top ring.

[0017] According to a sixth aspect of the present invention, the methodfor polishing a substrate comprises the steps of: bonding a polishingcloth to a polishing table, polishing substrates with said polishingcloth, removing said polishing cloth, bonding another polishing-cloth tosaid polishing table, and polishing substrates.

[0018] According to a seventh aspect of the present invention, themethod for polishing a substrate comprises the steps of: bonding a firstpolishing cloth to a polishing table, polishing substrates with saidfirst polishing cloth, removing said first polishing cloth, bonding asecond polishing cloth to said polishing table, polishing substrateswith said second polishing cloth, removing said second polishing cloth,and bonding said first polishing cloth to said polishing table.

[0019] The above and other objects, features and advantages of thepresent invention will become more apparent from the followingdescription of the preferred embodiments thereof, taken in conjunctionwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020]FIG. 1 is a diagram schematically showing the arrangement of theturntable part of a conventional polishing apparatus.

[0021]FIG. 2 is a diagram schematically showing the arrangement of theturntable part of a polishing apparatus according to the presentinvention.

[0022]FIG. 3 is a diagram showing a structural example of heat-sensitiveadhesive tape.

[0023]FIG. 4 is a diagram schematically showing the arrangement of theturntable part of a polishing apparatus according to the presentinvention.

[0024]FIG. 5(a) is an external perspective view showing a structuralexample of a heating jig.

[0025]FIG. 5(b) is a sectional view of the heating jig shown in FIG.5(a).

[0026]FIG. 6 is a diagram for describing a polishing cloth removingmethod according to the present invention.

[0027]FIG. 7 is a diagram for describing another polishing clothremoving method according to the present invention.

[0028]FIG. 8 is a diagram showing the relationship between thetemperature and the peel strength of heat-sensitive adhesive tape.

[0029]FIG. 9 is a diagram schematically showing the arrangement of thetop ring of a polishing apparatus according to the present invention.

[0030]FIG. 10 is a diagram showing a structural example of a jig usablefor bonding and removing expendable components of the top ring accordingto the present invention.

EXPLANATION OF REFERENCE NUMERALS

[0031]10: turntable

[0032]11: polishing cloth

[0033]12: pressure-sensitive adhesive

[0034]13: heat-sensitive adhesive tape

[0035]14: motor

[0036]15: heating/cooling system

[0037]16: rotary joint

[0038]20: heating jig

[0039]21: collar

[0040]22: heating wire

[0041]30: cooling jig

[0042]31: collar

[0043]32: refrigerant system

[0044]40: top ring

[0045]41: substrate holding plate

[0046]42: bolt

[0047]43: retainer ring

[0048]44: recess

[0049]45: pressure ring

[0050]46: backing film

[0051]47: mounting flange

[0052]48: shaft

[0053]49: driving shaft flange

[0054]50: ball bearing

[0055]51: space

[0056]52: communicating hole

[0057]60: plate-shaped heater

[0058]61: heating wire

[0059]62: plug socket

DETAILED DESCRIPTION OF THE INVENTION

[0060] Embodiments of the present invention will be described below withreference to the accompanying drawings. FIG. 2 is a diagram showing astructural example of the turntable part of a polishing apparatusaccording to the present invention. As illustrated in the figure, apolishing cloth 11 is bonded to the top surface of a turntable 10 with apiece of heat-sensitive adhesive tape 13 interposed between thepolishing cloth 11 and the top surface of the turntable 10. It should benoted that reference numeral 14 denotes a motor for rotating theturntable 10 in the direction of the arrow A. As shown in FIG. 3, theheat-sensitive adhesive tape 13 comprises a PET (polyethyleneterephthalate) film 13-1 and a heat-sensitive adhesive 13-2 applied toboth sides of the PET film 13-1.

[0061] The heat-sensitive adhesive 13-2 on both sides of the PET film13-1 constituting the heat-sensitive adhesive tape 13 is an adhesiveknown as “Intelimer” (registered trademark of Landec Corporation,U.S.A.). Intelimer is an adhesive that undergoes a reversible changefrom a crystalline state to an amorphous state according to changes intemperature of the outside. As shown in FIG. 8, one type of Intelimerfunctions as an ordinary adhesive (exhibiting high peel strength) belowa preset temperature (switching temperature) Ts. However, above the settemperature Ts, the peel strength decreases, so that the Intelimer tapecan be peeled off easily. There is another type of Intelimer that actsreversely to the above. That is, this type of Intelimer functions as anordinary adhesive above a preset temperature Ts. However, below the settemperature Ts, the peel strength decreases, so that the Intelimer tapecan be peeled off easily. In this embodiment, Intelimer tape availablefrom Nitta Corporation (Japan) is used as the heat-sensitive adhesivetape 13.

[0062] Thus, the polishing cloth 11 may be bonded to the top surface ofthe turntable 10 by using a heat-sensitive adhesive tape 13 in which theheat-sensitive adhesive 13-2 functions as an ordinary adhesive below theset temperature but decreases in peel strength above the settemperature. To bond the polishing cloth 11 to the top surface of theturntable 10 by using such a heat-sensitive adhesive tape 13, forexample, the top surface of the turntable 10 is heated to apredetermined temperature higher than the set temperature, and thepolishing cloth 11 is placed over the top surface of the turntable 10with the heat-sensitive adhesive tape 13 interposed therebetween. Inthis case, because the top surface temperature of the turntable 10 ishigher than the set temperature, the peel strength of the heat-sensitiveadhesive 13-2 is low, which facilitates the alignment of the polishingcloth 11 and the heat-sensitive adhesive tape 13 on the top surface ofthe turntable 10. In this state, the turntable 10 is cooled down to apredetermined temperature below the set temperature (e.g. to atemperature lower than the set temperature by 10° C. or more), and theupper surface of the polishing cloth 11 is pressed with a rubber rolleror the like. Thus, the polishing cloth 11 can be bonded to the topsurface of the turntable 10 with the heat-sensitive adhesive tape 13interposed therebetween.

[0063] The heat-sensitive adhesive 13-2 can be kept in a state where thepeel strength is high by maintaining the temperature of the turntable 10in use at a level lower than the set temperature by a predeterminedtemperature. Therefore, there is no possibility of the polishing cloth11 undesirably separating from the turntable 10. To remove the polishingcloth 11 from the turntable 10, the turntable 10 is heated to apredetermined temperature above the set temperature (e.g. to atemperature higher than the set temperature by 10° C. or more).Consequently, the peel strength of the heat-sensitive adhesive 13-2decreases. Therefore, the polishing cloth 11 can be readily removed fromthe turntable 10. In a case where the heat-sensitive adhesive 13-2 isadhesive above a set temperature but non-adhesive below the settemperature, the temperature of the turntable 10 in use is maintained ata predetermined temperature above the set temperature. To remove thepolishing cloth 11, the turntable 10 is cooled down to a predeterminedtemperature below the set temperature.

[0064]FIG. 4 is a diagram showing a structural example of the turntablepart of a polishing apparatus according to the present invention. Asillustrated in the figure, a heating/cooling system 15 for heating orcooling is provided in the turntable 10 through a rotary joint 16. Theheating/cooling system 15 is supplied with a heating heat transfermedium Q₁ or a cooling refrigerant Q₂ from a heat transfer medium sourceor a refrigerant source (not shown). Thus, the heating heat transfermedium Q₁ or the cooling refrigerant Q₂ can be circulated through theheating/cooling system 15.

[0065] In the case of using the heat-sensitive adhesive tape 13 in whichthe heat-sensitive adhesive 13-2 is adhesive above a set temperature butnon-adhesive below the set temperature, when the polishing cloth 11 isto be bonded, the cooling refrigerant Q₂ is circulated through theheating/cooling system 15 to cool and maintain the top surface of theturntable 10 at a predetermined temperature below the set temperature.In this state, the polishing cloth 11 is placed over the top surface ofthe turntable 10 with the heat-sensitive adhesive tape 13 interposedtherebetween. In this state, the peel strength of the heat-sensitiveadhesive 13-2 is low. Therefore, it is easy to perform alignment of theheat-sensitive adhesive tape 13 and the polishing cloth 11. Uponcompletion of the alignment, the circulation of the cooling refrigerantQ₂ is stopped to allow the turntable 10 to rise in temperature.Alternatively, the heating heat transfer medium Q₁ is circulated throughthe heating/cooling system 15 to raise the temperature of the turntable10 positively. By doing so, the temperature of the turntable 10 israised to a predetermined level above the set temperature. This allowsthe heat-sensitive adhesive 13-2 to exhibit adhesiveness (tackiness).Therefore, the polishing cloth 11 can be bonded by pressing the uppersurface of the polishing cloth 11 with a rubber roller or the like.

[0066] By setting the set temperature of the heat-sensitive adhesive13-2 at a predetermined temperature lower than the working temperatureof the turntable 10, the polishing cloth 11 is kept bonded to the topsurface of the turntable 10 by the strong adhesiveness of theheat-sensitive adhesive 13-2 during the substrate polishing process.Therefore, there is no possibility that the polishing cloth 11 mayundesirably separate from the turntable 10. When the polishing cloth 11is to be temporarily removed and bonded again or to be replaced withanother polishing cloth 11, the cooling refrigerant Q₂ is circulatedthrough the heating/cooling system 15 to cool the top surface of theturntable 10 to a predetermined temperature below the set temperature.Consequently, the heat-sensitive adhesive 132 loses its adhesiveness.Therefore, it becomes possible to remove the polishing cloth 11 easily.

[0067] In the case of using the heat-sensitive adhesive tape 13 in whichthe heat-sensitive adhesive 13-2 is non-adhesive above a set temperaturebut adhesive below the set temperature, when the polishing cloth 11 isto be bonded, the heating heat transfer medium Q₁ is circulated throughthe heating/cooling system 15 to heat the top surface of the turntable10 to a predetermined temperature above the set temperature. In thisstate, the polishing cloth 11 is placed over the top surface of theturntable 10 with the heat-sensitive adhesive tape 13 interposedtherebetween. In this state, the heat-sensitive adhesive 13-2 isnon-adhesive. Therefore, it is easy to perform alignment of theheat-sensitive adhesive tape 13 and the polishing cloth 11. Uponcompletion of the alignment, the circulation of the heating heattransfer medium Q₁ is stopped to allow the turntable 10 to lower intemperature. Alternatively, the cooling refrigerant Q₂ is circulatedthrough the heating/cooling system 15 to lower the temperature of theturntable 10 positively. By doing so, the temperature of the turntable10 is lowered to a predetermined level below the set temperature. Thisallows the heat-sensitive adhesive 13-2 to exhibit adhesiveness.Therefore, the polishing cloth 11 can be bonded by pressing the uppersurface of the polishing cloth 11 with a rubber roller or the like.

[0068] By setting the set temperature of the heat-sensitive adhesive13-2 at a predetermined temperature higher than the working temperatureof the turntable 10, the polishing cloth 11 is kept bonded to the topsurface of the turntable 10 by the strong adhesiveness of theheat-sensitive adhesive 13-2 during the substrate polishing process.Therefore, there is no possibility that the polishing cloth 11 mayundesirably separate from the turntable 10. When the polishing cloth 11is to be temporarily removed and bonded again or replaced with anotherpolishing cloth 11, the heating heat transfer medium Q₁ is circulatedthrough the heating/cooling system 15 to heat the top surface of theturntable 10 to a predetermined temperature above the set temperature.Consequently, the peel strength of the heat-sensitive adhesive 13-2decreases. Therefore, it becomes possible to remove the polishing cloth11 easily.

[0069] The heating heat transfer medium Q₁ or the cooling refrigerant Q₂may be supplied to the heating/cooling system 15 during the operation ofthe turntable 10 to maintain the top surface of the turntable 10 at atemperature above or below the set temperature of the heat-sensitiveadhesive 13-2 at which the heat-sensitive adhesive 13-2 exhibits strongadhesiveness. During the suspension of the operation, the adhesivenessof the heat-sensitive adhesive 13-2 may be reduced.

[0070] In the example shown in FIG. 4, the heating/cooling system 15 forheating or cooling is provided in the turntable 10. It should be noted,however, that the polishing cloth 11 bonded to the turntable 10 can alsobe removed by using a heating jig 20 as shown in FIGS. 5(a) and 5(b).That is, the heating jig 20 is in the shape of a disk having a geometrycapable of covering the turntable 10. The disk-shaped heating jig 20 hasa collar 21 formed around the periphery thereof. The heating jig 20 hasa heating wire 22 buried therein. The whole heating jig 20 can be heatedby supplying a heating current to the heating wire 22 from an AC or DCpower supply. It should be noted that FIG. 5(a) is a perspective viewshowing the whole heating jig 20, and FIG. 5(b) is a sectional view ofthe heating jig 20.

[0071] The process of removing the polishing cloth 11 from the topsurface of the turntable 10 by using the heating jig 20 shown in FIGS.5(a) and 5(b) will be described below with reference to FIG. 6. It isassumed that the heat-sensitive adhesive tape 13 used in this examplehas a heat-sensitive adhesive 13-2 that is non-adhesive above a settemperature but adhesive below the set temperature, and that the settemperature is a predetermined temperature above the working temperatureof the turntable 10. First, the polishing cloth 11 is bonded to the topsurface of the turntable 10 at the working temperature with theheat-sensitive adhesive tape 13 interposed therebetween, and used forpolishing substrates. When the polishing cloth 11 is to be temporarilyremoved and bonded again or to be replaced with another polishing cloth11, the heating jig 20 is put over the polishing cloth 11 on theturntable 10, and the heating wire 22 is supplied with a heatingcurrent. Thus, the heating jig 20 heats up. Consequently, theheat-sensitive adhesive 13-2 of the heat-sensitive adhesive tape 13loses its adhesiveness to become non-adhesive. In this state, theheating jig 20 is taken off, and the polishing cloth 11 is removed fromthe turntable 10. Thus, the polishing cloth 11 can be removed from theturntable 10 easily with minimal removal force.

[0072] In the case of using the heat-sensitive adhesive tape 13 in whichthe heat-sensitive adhesive 13-2 is non-adhesive at a predetermined settemperature below the working temperature of the turntable 10 butadhesive above the set temperature, the polishing cloth 11 is bonded tothe top surface of the turntable 10 at the working temperature with theheat-sensitive adhesive tape 13 interposed therebetween, and used forpolishing substrates. When the polishing cloth 11 is to be temporarilyremoved and bonded again or to be replaced with another polishing cloth11, a cooling jig 30 is put over the polishing cloth 11, as shown inFIG. 7 by way of example. The cooling jig 30 has a refrigerant system 32buried therein for passing a cooling refrigerant Q₃ [the externalgeometry of the cooling jig 30 is almost the same as that of the heatingjig 20 shown in FIGS. 5(a) and 5(b); the disk-shaped cooling jig 30 hasa collar 31 formed around the periphery thereof]. Then, the refrigerantsystem 32 is supplied with the cooling refrigerant Q₃. Thus, theheat-sensitive adhesive 13-2 of the heat-sensitive adhesive tape 13 iscooled down to a predetermined temperature below the set temperature andhence loses its adhesiveness to become non-adhesive. In this state, thecooling jig 30 is taken off, and the polishing cloth 11 is removed fromthe turntable 10. Thus, the polishing cloth 11 can be removed from theturntable 10 easily with minimal removal force.

[0073] As has been stated above, the polishing cloth 11 is bonded to thetop surface of the turntable 10 with the heat-sensitive adhesive tape 13interposed therebetween. Therefore, the polishing cloth 11 can be bondedand removed easily by controlling the temperature of the turntable 10.The use of the heating jig 20 or the cooling jig 30 allows the bondedpolishing cloth 11 to be removed from the turntable 10 easily withminimal removal force. Accordingly, the replacement operation for thepolishing cloth 11 is improved to a considerable extent. Consequently,it becomes unnecessary to perform the conventional troublesome removingoperation using a special jig. In addition, it becomes possible toremove the polishing cloth 11 temporarily before the time forreplacement and to reuse it later. For example, when the user wants toperform another polishing process in the course of use of the polishingcloth 11, it is possible to remove the polishing cloth 11 temporarily,bond another kind of polishing cloth 11, remove this polishing cloth 11after the desired polishing process, and bond the first-removedpolishing cloth 11 again to perform the previous polishing process.

[0074] The heat-sensitive adhesive tape 13 can be switched between theadhesive state and the non-adhesive state by selectively heating andcooling the turntable 10 by the use of the temperature control functionof cooling water in the turntable 10. However, in a case where such aswitching operation cannot readily be implemented owing to some problemswith the chiller equipment in the plant, the use of the heating jig 20for heating the polishing cloth 11 allows the heat-sensitive adhesivetape 13 to be readily switched between the adhesive state and thenon-adhesive state.

[0075] Although in the foregoing embodiment the present invention hasbeen described with regard to the polishing apparatus using theturntable 10, by way of example, the present invention is notnecessarily limited to the polishing apparatus using the turntable 10.The present invention is widely applicable to any polishing apparatushaving a table with a polishing cloth bonded thereto, wherein an objectto be polished is brought into contact with the surface of the polishingcloth on the table and polished by a relative motion between thepolishing cloth and the object.

[0076] In the foregoing embodiment, the polishing cloth 11 is bonded tothe top surface of the turntable 10 of the polishing apparatus with theheat-sensitive adhesive tape 13 interposed between the top surface ofthe turntable 10 and the polishing cloth 11. However, the presentinvention is not necessarily limited to the described embodiment. Forexample, the present invention is also applicable to a backing film anda pressure ring that are bonded to a top ring. FIG. 9 is a sectionalview showing a structural example of a top ring according to the presentinvention.

[0077] As shown in FIG. 9, the top ring 40 according to the presentinvention has a substrate holding plate 41 and a retainer ring 43detachably secured to the outer peripheral portion of the substrateholding plate 41 with bolts 42. A recess 44 for accommodating asubstrate Wf is formed by the lower surface (substrate holding surface)of the substrate holding plate 41 and the retainer ring 43. A pressurering 45 is vertically movably provided around the substrate holdingplate 41. The substrate holding plate 41 has a backing film 46 bonded tothe lower surface thereof. Further, the substrate holding plate 41 has amounting flange 47 secured to the center of the upper surface thereof.The mounting flange 47 has a concave spherical surface 47 a.

[0078] A shaft 48 is disposed above the mounting flange 47. The shaft 48has a driving shaft flange 49 secured to the lower end thereof. Thedriving shaft flange 49 has a concave spherical surface 49 a. A ballbearing 50 is interposed between the concave spherical surface 47 a andthe concave spherical surface 49 a. A space 51 is formed between thesubstrate holding plate 41 and the mounting flange 47. The space 51 canbe selectively supplied with a vacuum or a fluid such as pressurized airor water. The substrate holding plate 41 has communicating holes 52opening on the lower surface thereof. The communicating holes 52 are incommunication with the space 51. The backing film 46 also hasthrough-holes formed at respective positions facing the communicatingholes 52. Thus, the upper surface of the substrate Wf can be held by avacuum to the lower surface of the substrate holding plate 41 throughthe backing film 46. It is also possible to supply a fluid such as aliquid or pressurized air to the upper surface of the substrate Wf.

[0079] The pressure ring 45 comprises a first pressure ring member 45 alocated at the lowermost position and made of alumina ceramics, andsecond and third pressure ring members 45 b and 45 c disposed above thefirst pressure ring member 45 a and made of a stainless steel. Thesecond and third pressure ring members 45 b and 45 c are connected toeach other with bolts (not shown). The first pressure ring member 45 ais bonded to the second pressure ring member 45 b. The lower end of thefirst pressure ring member 45 a forms a pressure surface 45 f forpressing the polishing cloth 11 (see FIG. 2) bonded to the top surfaceof the turntable 10.

[0080] In operation, a substrate Wf is held by suction to the lowersurface of the backing film 46 bonded to the lower surface of thesubstrate holding plate 41 of the top ring 40 arranged as stated above.Then, the substrate Wf is pressed against the upper surface of thepolishing cloth 11 on the turntable 10 shown in FIG. 2. In this state,the substrate Wf is polished by a relative motion between the substrateWf and the polishing cloth 11 caused by the rotation of the top ring 40about the shaft 48 and the rotation of the turntable 10. The polishingoperation causes the first pressure ring member 45 a of the pressurering 45 to wear out. Therefore, the first pressure ring member 45 aneeds to be replaced when it has worn out to a predetermined extent. Thebacking film 46 also wears out in the course of polishing a large numberof substrates Wf. Therefore, the backing film 46 also needs to bereplaced at a predetermined timing.

[0081] In this embodiment, the above-described heat-sensitive adhesivetape (not shown in FIG. 9) is used for the first pressure ring member 45a and the backing film 46. More specifically, a piece of heat-sensitiveadhesive tape is interposed between the first pressure ring member 45 aand the second pressure ring member 45 b of the pressure ring 45 to bondthe first pressure ring member 45 a to the lower surface of the secondpressure ring member 45 b. Further, a piece of heat-sensitive adhesivetape is interposed between the backing film 46 and the substrate holdingplate 41 to bond the backing film 46 to the lower surface of thesubstrate holding plate 41.

[0082] By using the heat-sensitive adhesive tape to bond the firstpressure ring member 45 a to the second pressure ring member 45 b andalso using the heat-sensitive adhesive tape to bond the backing film 46to the lower surface of the substrate holding plate 41, the firstpressure ring member 45 a and the backing film 46 can be bonded andremoved extremely easily by the temperature control of theheat-sensitive adhesive tape as in the case of the above.

[0083] The bonding and removing operation may be carried out by using aplate-shaped heater 60 having a heating wire 61 as shown in FIG. 10 byway of example. That is, the plate-shaped heater 60 is brought intocontact with the backing film 46 or the first pressure ring member 45 a,and the heating wire 61 is supplied with a heating current through aplug socket 62 to heat the backing film 46 or the first pressure ringmember 45 a, thereby allowing the backing film 46 or the first pressurering member 45 a to be bonded or removed easily.

[0084] It should be noted that the structural example of the top ring isnot necessarily limited to the above. For example, the present inventionis similarly applicable to a top ring employing a retainer ring directlyretaining the side surface of a substrate.

[0085] Although in the foregoing embodiments the present invention hasbeen described with regard to the operation of bonding and removing thebacking film 46, the first pressure ring member 45 a and the polishingcloth 11, by way of example, it should be noted that the presentinvention is not necessarily limited thereto but may be used for bondingand removing various expendable replacement components to be bonded tothe top ring or the polishing table of the polishing apparatus.

[0086] As has been stated above, the present invention provides variousadvantageous effects as stated below.

[0087] According to the first and second aspects of the presentinvention, pieces of heat-sensitive adhesive tape are interposed betweenexpendable replacement components such as a backing film, a pressurering and a polishing cloth on the one hand and the top ring and thepolishing table on the other to bond the expendable replacementcomponents to the top ring and the polishing table. The heat-sensitiveadhesive tape has the nature of switching between a non-adhesive stateand a adhesive state according to whether the temperature thereof ishigher or lower than a predetermined set temperature. Therefore, theexpendable replacement components can be bonded and removed easily byheating or cooling the heat-sensitive adhesive tape above or below theset temperature. Particularly, when the heat-sensitive adhesive tape ismade non-adhesive by heating or cooling, the expendable replacementcomponents can be removed easily with minimal removal force. Further,because the removal force is minimized, the expendable replacementcomponents can be removed without being damaged. Accordingly, it becomespossible to remove the expendable replacement components temporarilybefore the time for replacement and to reuse them later.

[0088] According to the third to fifth aspects of the present invention,pieces of heat-sensitive adhesive tape are interposed between expendablereplacement components such as a backing film, a pressure ring and apolishing cloth on the one hand and the top ring and the polishing tableon the other, and the heat-sensitive adhesive tape is switched between anon-adhesive state and a adhesive state by heating or cooling it aboveor below a set temperature. Therefore, it is easy to bond and remove theexpendable replacement components. Particularly, when the heat-sensitiveadhesive tape is made non-adhesive, the expendable replacementcomponents can be removed easily with minimal removal force.Accordingly, it is possible to obtain advantageous effects similar tothose obtained by the arrangement according to the first and secondaspects of the present invention.

[0089] According to the fourth aspect of the present invention, theheat-sensitive adhesive tape can be made non-adhesive easily by using ajig for heating or cooling the heat-sensitive adhesive tape.

[0090] It should be noted that the present invention is not necessarilylimited to the foregoing embodiments but can be modified in a variety ofways without departing from the gist of the present invention.

What is claimed is:
 1. A polishing apparatus for polishing substrate,comprising a polishing table, wherein an expendable replacementcomponent is bonded to said polishing table in such a manner that apiece of heat-sensitive adhesive tape is interposed between saidexpendable replacement component and said polishing table, saidheat-sensitive adhesive tape being switchable between a non-adhesivestate and a adhesive state according to whether a temperature thereof ishigher or lower than a predetermined set temperature.
 2. A polishingapparatus according to claim 1, wherein said expendable replacementcomponent is a polishing cloth.
 3. A polishing apparatus according toclaim 1, wherein said heat-sensitive adhesive tape exhibits adhesivenessat a temperature higher than said set temperature but loses theadhesiveness at a temperature lower than said set temperature.
 4. Apolishing apparatus according to claim 1, wherein said heat-sensitiveadhesive tape exhibits adhesiveness at a temperature lower than said settemperature but loses the adhesiveness at a temperature higher than saidset temperature.
 5. A polishing apparatus according to claim 1, whereinsaid polishing table has a heat transfer medium passage so that a heattransfer medium for heating or cooling circulates through said heattransfer medium passage to heat or cool said polishing table.
 6. Apolishing apparatus for polishing a substrate, comprising a top ring forholding a substrate, wherein an expendable replacement component isbonded to said top ring in such a manner that a piece of heat-sensitiveadhesive tape is interposed between said expendable replacementcomponent and said top ring, said heat-sensitive adhesive tape beingswitchable between a non-adhesive state and a adhesive state accordingto whether a temperature thereof is higher or lower than a predeterminedset temperature.
 7. A polishing apparatus according to claim 6, whereinsaid expendable replacement component is a backing film or a pressurering, said backing film being bonded to a substrate holding surface ofsaid top ring, and said pressure ring being bonded to said top ring andpositioned at an outer peripheral portion of the substrate as held bysaid top ring.
 8. A polishing apparatus according to claim 6, whereinsaid heat-sensitive adhesive tape exhibits adhesiveness at a temperaturehigher than said set temperature but loses the adhesiveness at atemperature lower than said set temperature.
 9. A polishing apparatusaccording to claim 6, wherein said heat-sensitive adhesive tape exhibitsadhesiveness at a temperature lower than said set temperature but losesthe adhesiveness at a temperature higher than said set temperature. 10.An expendable replacement component bonding and removing method for usein a polishing apparatus, said polishing apparatus having a top ring forholding a substrate and a polishing table having a polishing surface,said method comprising the steps of: placing expendable replacementcomponents to be bonded to said top ring and said polishing table oversaid top ring and said polishing table in such a manner that pieces ofheat-sensitive adhesive tape are interposed between said expendablereplacement components on the one hand and said top ring and saidpolishing table on the other, said heat-sensitive adhesive tape beingswitchable between a non-adhesive state and a adhesive state accordingto whether a temperature thereof is higher or lower than a predeterminedset temperature; and heating or cooling said heat-sensitive adhesivetape above or below said set temperature, thereby bonding saidexpendable replacement components to said top ring and said polishingtable or removing said expendable replacement components bonded to saidtop ring and said polishing table.
 11. An expendable replacementcomponent bonding and removing method according to claim 10, whereinsaid expendable replacement components are bonded to said top ring andsaid polishing table or removed from said top ring and said polishingtable by using a jig for heating or cooling said pieces ofheat-sensitive adhesive tape.
 12. An expendable replacement componentbonding and removing method according to claim 10, wherein saidexpendable replacement components are at least one selected from thegroup consisting of a polishing cloth bonded to a top surface of saidpolishing table, a backing film bonded to a substrate holding surface ofsaid top ring, and a pressure ring bonded to said top ring andpositioned at an outer peripheral portion of the substrate as held bysaid top ring.
 13. An expendable replacement component bonding andremoving method according to claim 10, wherein said heat-sensitiveadhesive tape exhibits adhesiveness at a temperature higher than saidset temperature but loses the adhesiveness at a temperature lower thansaid set temperature, so that said heat-sensitive adhesive tape iscooled below said set temperature to bond or remove said expendablereplacement components.
 14. An expendable replacement component bondingand removing method according to claim 10, wherein said heat-sensitiveadhesive tape exhibits adhesiveness at a temperature lower than said settemperature but loses the adhesiveness at a temperature higher than saidset temperature, so that said heat-sensitive adhesive tape is heatedabove said set temperature to bond or remove said expendable replacementcomponents.
 15. An expendable replacement component bonding and removingmethod according to claim 14, wherein said jig is a plate-shaped heater.16. An apparatus for polishing a substrate, comprising: a polishingtable, a heat-sensitive adhesive tape disposed on said polishing tableand having a switchable temperature on which said heat-sensitiveadhesive tape losing adhesiveness, and a polishing pad disposed on saidheat-sensitive adhesive tape.
 17. An apparatus for polishing asubstrate, comprising: a polishing table, a heat-sensitive adhesivedisposed on said polishing table and having a switchable temperature onwhich said heat-sensitive adhesive losing adhesiveness, and a polishingpad disposed on said heat-sensitive adhesive.
 18. A method for polishinga substrate, comprising: bonding a polishing cloth to a polishing table,polishing substrates with said polishing cloth, removing said polishingcloth, bonding another polishing cloth to said polishing table, andpolishing substrates.
 19. A method for polishing a substrate,comprising: bonding a first polishing cloth to a polishing table,polishing substrates with said first polishing cloth, removing saidfirst polishing cloth, bonding a second polishing cloth to saidpolishing table, polishing substrates with said second polishing cloth,removing said second polishing cloth, and bonding said first polishingcloth to said polishing table.
 20. A polishing apparatus for polishingsubstrate, comprising a polishing table, wherein an expendablereplacement component is bonded to said polishing table in such a mannerthat a heat-sensitive adhesive is interposed between said expendablereplacement component and said polishing table, said heat-sensitiveadhesive being switchable between a non-adhesive state and a adhesivestate according to whether a temperature thereof is higher or lower thana predetermined set temperature.
 21. A polishing apparatus according toclaim 20, wherein said expendable replacement component is a polishingcloth.
 22. A polishing apparatus according to claim 20, wherein saidheat-sensitive adhesive exhibits adhesiveness at a temperature higherthan said set temperature but loses the adhesiveness at a temperaturelower than said set temperature.
 23. A polishing apparatus according toclaim 20, wherein said heat-sensitive adhesive exhibits adhesiveness ata temperature lower than said set temperature but loses the adhesivenessat a temperature higher than said set temperature.
 24. A polishingapparatus according to claim 20, wherein said polishing table has a heattransfer medium passage so that a heat transfer medium for heating orcooling circulates through said heat transfer medium passage to heat orcool said polishing table.